Placement solutions for panels used in communication infrastructure
Placement solutions for panels used in communication infrastructure
Stability and improvements in processing capability are sought from 5G base stations and servers so that large data loads can be processed without delay. The electronic panels and electronic parts used in data processing are becoming larger and heavier in order to support the high-speed processing of large volumes of data and higher performance, and the SMT process must be able to respond to these changes.
Here we will introduce placement solutions that are necessary for the production of 5G base station and server boards.
Trends in panels used in communication infrastructure
Electronic parts: Larger CPU components and increased memory capacity for increased processing capability
Electronic panels: Increases in size in accordance with the attachment of sub boards, and larger parts and multilayering to increase the processing capability
Increase in production volume and product types
Issues at SMT stages for communication infrastructure, and Fuji's solutions for these
Electronic parts: Larger CPU components and increased memory capacity for increased processing capability
As the performance of CPUs has improved, packages and socket parts have become larger and heavier.
Here we have solutions for reliable pickup and placement of these larger and heavier parts.
Reliable pickup and placement of increasingly heavy parts - DX head S1 tool
The S1 tool for the DX head can stably pick up and place parts weighing up to 250 g.
It is possible to have in-line production of key parts such as CPU packages, which are becoming larger and heavier.
Note: The transportable weight is different depending on the part shape.
Prevent defects during secondary melting - DX head glue tool
The gluing process for specific parts does not have to be a dedicated stage, but instead applied in the placement stage. An effective solution for preventing large BGAs and unstable odd-form parts from coming off or falling over during secondary melting.
Note: Applicable machines: AIMEX III、AIMEX IIIc
Secure holding and accurate positioning of odd-form parts - Custom nozzles and chucks
It is possible to create custom chucks and nozzles to ensure secure holding of odd-form parts and heavy parts that have little clamping surface and clamping allowances.
Secure holding and accurate positioning of odd-form parts - Custom nozzles and chucks
It is possible to create custom chucks and nozzles to ensure secure holding of odd-form parts and heavy parts that have little clamping surface and clamping allowances.
What This Means for the Industry:
FUJI's solutions address the critical need for precision and efficiency in the production of 5G infrastructure components. As 5G technology continues to roll out globally, the ability to produce high-quality, reliable components at scale is essential. FUJI's advanced placement machines and software are designed to meet these demands, ensuring that the electronic panels and parts used in 5G applications can be manufactured with the required speed and accuracy.
SIPLACE SX: Highly flexible with capacity-on-demand
Yamaha High-speed Dispenser YSD: Precision and Speed in SMT
