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ASM SIPLACE CA SMT Pick and Place machine
ASM SIPLACE CA
The SIPLACE CA can be integrated with advanced software solutions for optimized production planning, component library management, and process control. This enhances overall production efficiency and traceability.
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ASM SIPLACE CA SMT Pick & Place machine
The ASM SIPLACE CA series is a highly advanced placement solution provided by ASM Assembly Systems, designed to address high-speed growth technologies and advanced packaging (SiP) applications in the electronics manufacturing industry. Here are the main features and advantages of the SIPLACE CA2:
- High-Speed Wafer-Level Chip Assembly and SMT Placement: The SIPLACE CA2 can process SMD components supplied from feeders and chips taken directly from sawn wafers in a single work step.
- Cost-Effectiveness and Sustainability: Direct placement from the wafer eliminates the entire die taping process, reducing the need for replenishment or splicing, and decreasing material feeding efforts, which contributes to increased cost-effectiveness and sustainability.
- Hybrid Equipment: The SIPLACE CA2 combines an SMT placement machine with a die bonder, capable of handling SMT components and wafer chips in the same process step.
- Perfect Match for Smart Factories: With high connectivity and integrated data utilization, it reduces personnel deployment and is well-suited to the needs of smart factories.
- Wide Range of Component Handling: Supports a component range from 01005 (0.4mm x 0.2mm) to large ICs and connectors.
- High Placement Speed: Achieves a placement speed of up to 75,000 components per hour in SMT placement, and up to 50,000 chips per hour when placing chips from the wafer.
- High Precision Placement: Offers placement accuracy of 20µm, 15µm, or 10µm (3σ) depending on the component level.
- Flexible Wafer Handling Capability: Can handle up to 50 different wafers with a wafer swap time of less than 6 seconds.
- Advanced Vision System: Multiple high-end vision processing systems reliably recognize even the smallest components and elements for comprehensive process control.
- Modular Design: The SIPLACE CA2 can be flexibly configured according to the specific needs of the production line.
By seamlessly integrating bare chip and traditional ASM Pick and Place machine, the SIPLACE CA2 offers users a clear competitive advantage, enabling the realization of new, future-oriented applications without the need for additional special processes. This device is not only suitable for advanced packaging applications but can also serve as a powerful traditional SMT placement machine.
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